OCZ Unveils RAM with NEW Passive Cooling Solution Stephen Fung February 23, 2007 Press Release Sunnyvale, CA—February 21, 2007—OCZ Technology Group, Inc., a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the OCZ PC2-8500 Reaper HPC Series. This 2GB dual channel kit features the proprietary OCZ Reaper HPC (Heat Pipe Conduit) heatspreader, engineered to deliver superior silent heat dissipation over traditional heatspreaders. The Reaper HPC is an innovative cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules. “Overclocking and efficient cooling do not have to be noisy. The Reaper HPC series integrates silent heat pipe technology into a premium memory product line to assure perfect thermal management of the latest generation of OCZ high-speed DDR2 modules,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. ”Any noise-conscious end user relying on silent passive cooling while demanding the highest performance will embrace the quality balance of features and innovative design found in the new Reaper HPC series.” The first modules to be incorporated with the new Reaper heatsink are rated at 1066MHz and run at CL 5-5-5. Featuring an EPP (Enhanced Performance Profiles) programmed SPD, PC2-8500 Reaper HPC modules will immediately boot at the rated specs on the latest generation of NVIDIA® SLI™ chipsets. For more information on the OCZ PC2-8500 Reaper HPC Series, please visit our product page here. Share This With The World!