OCZ Unveils PC2-9200 Reaper HPC Series with Passive Heatpipe Cooling System

Sunnyvale, CA—October 10, 2007OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today announced the 4GB PC2-6400 CL4 series, the latest edition to the highly-awarded OCZ Reaper HPC (Heat Pipe Conduit) product family. With a proven performance design coupled with the blazing latencies and memory capacity enthusiasts crave, the 4GB PC2-6400 Reaper CL4 series provides rock-solid stability and performance on the latest AMD and Intel platforms.

The Reaper CL4 4GB kit is designed to offer consumers a high end, high density kit that is optimized for gamers who require both faster and more memory to power through the latest graphic-intensive applications and games. The Reaper series makes use of the HPC heatspreader, an innovative patent-pending cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules.

“The new Reaper HPC 4GB Cas 4 kits offer consumers a premium memory solution complete with innovative cooling,” stated Jacky Huang, VP of Product Management, OCZ Technology Group. “Due to an advanced thermal design the Reaper HPC high density 4GB kit offers consumers a robust product for gamers, system builders, and case modders looking for a premium solution for all platforms.”

More information can be found on the new product page.

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