Cooler Master Quickly takes next step with Vapor Chamber Technology James White August 8, 2012 Press Release The two most important aspects of a CPU cooler are heat dissipation capacity and efficiency. Basically it is all about how much heat can it absorb and how fast can it do it. The issue is the objective of spreading the heat generated by the CPU over a large surface area is now more difficult due to current generation CPUs having some sections that generate more heat than others. Well, Cooler Master Vapor Chamber Technology could be the answer. Instead of using a solid metal block at the bottom of the CPU cooler, a Horizontal Vapor Chamber system will instead contain a vaporized mixture. When the CPU generates heat from anywhere on its surface, the vapor will absorb the heat, and distribute it across the entire surface of the heat sink, not just the local area. The actual changes in phases from liquid to gas and back create a circulation of heat up to 8 times more efficient than traditional coolers. Other coolers have been doing something similar with the heat pipes for years, but Cooler Master is moving this to apply to the base of the cooler as well. The upcoming Cooler Master V4 GT, first to have CM Vapor Chamber Tech, should be an interesting cooler. It can be smaller with a lower speed fan without losing overall heat dissipation when compared to other coolers. Thanks to AMD Core Boost and Intel Turbo Boost, better temperature control could improve your system performance. [hide-this-part morelink=”Full Press Release”] July 31st, 2012 – Cooler Master announces further integration of Vapor Chambers into its retail Heatsinks. After releasing the world’s first heatpipe heatsink in 2000, and the first vertical vapor chamber Heatsink in early 2012, Cooler Master today announces broader adoption of Vapor Chamber Technology developed by Cooler Master’s OEM and industrial cooling division in its retail Heatsinks. After the success of the TPC812 pioneering the use of modern vertical vapor chambers, Cooler Master is expanding the TPC series and will equip selected Models of the V series with Horizontal Vapor Chambers. Horizontal Vapor Chambers spread Heat 8x faster than solid copper, eliminating hot spots and spreading heat evenly across the base of a heatsink. Since the vapor chamber effectively increases the heatpipe contact area, it allows the use of a larger number of heatpipes. Overall Horizontal Vapor Chambers enable faster and more efficient transfer of heat from the CPU to the heatpipes and fins, resulting in lower temperatures and slower, less noisy fans. Modern processors feature multiple CPU cores and integrated GPUs, resulting in hot spots, tiny parts of the CPU that product significantly more heat than others. Thanks to advanced thermal management, processors can boost the speed of individual cores if the processor is cooled well enough. Horizontal vapor chambers help eliminate hot spots and remove heat at unprecedented speeds, allowing your CPU to boost its performance and notably improve system performance. Vertical Vapor Chambers allow Cooler Master to develop Heatsinks that help your system run cooler, quieter, and faster. The first Cooler Master Heatsink equipped with a horizontal vapor chamber, the V4 GT, will be officially released to the market in Q3, 2012. For more information on how Vapor Chambers work, please visit: http://odm.coolermaster.com/manufacture.php?page_id=9 [/hide-this-part] Share This With The World!