Back-to-Front Cooling on New PC-A05FN Mid-Tower From Lian Li James White June 22, 2011 The kings of well crafted computer enclosures Lian-Li, have released a new case to the market. While almost all cases have a front-to-back cooling scheme, there have been a few interesting designs with Bottom-to-Top Cooling Scheme. This is the first time I have seen Back-to-Front Cooling. The new PC-A05FN has a business style. Internally, three 3.5 and two 2.5 HDDs mount using thumb-screws with rubber-suspension. Two 5.25 ODDs mount with Lian Li’s tool-less design at the top of the front-panel. Directly beneath them, an external 3.5 HDD mount has been included as well. Additionally, there are eight, tool-less PCI brackets on the back-panel that can mount VGA cards as long as 280 mm (about 11 inches). Lian Li has made the PC-A05FN compatible with ATX, Micro-ATX, and Mini-ITX motherboards. The power switch is located along the right edge of the front-panel right above one USB 3.0 port, one USB 2.0 port, and HD Audio ports. The all-aluminum, PC-A05FN weighs in at 4.4kg. Its dimensions are 210mm x 385mm x 500mm (W, H, D). This exceptionally designed computer chassis is sure to be a hit with users who like to be on the front lines of innovation without sacrificing quality or style. The case will be available in black and silver. I like this idea as the front venting the hot air should disperse faster as the front of the case will have less obstructions than the back. This is because most people put their cases close to a wall or back of a desk. I am a little concerned the VGA cards and HDD. Since the air will come from the top back area of the case, your CPU will get the coolest air and leave the HDD’s and VGA with hot seconds. This should result in most CPU’s dropping a few degrees, with the VGA’s going up a few in response. Share This With The World!