The current motherboard market is one of the more over-saturated PC market areas. Every company tends to have 3 base models, 2 special editions, 2 microATX, and then double all that for AMD with every generation. The question becomes how do you get an individual motherboard to stand out? ASRock Z77 OC Formula decided to try pure sexy.
First is the Formula Power Kit. It’s a customer designed 12 + 4 power delivery system with digital PWM, dual-stack MOSFET, CHIL 8328 silicon, and specially selected caps to reduce power loss by 70%. Even if you don’t overclock the OC Formula, it should be one of the most power efficient motherboards on the market.
Next is the Formula Cooling Kit and Connector Kit for the Z77 OC Formula. The Cooling Kit consists of a tube of Gelid GC-Extreme thermal compound, 8 layer PCB, and a hybrid air/water cooling system to keep temperatures under control. This goes for high and extremely low temperatures with LN2 overclocking. The Connector Kit is the a set of carefully selected materials and design of every connector on the board to ensure clean power delivery.
I could go on and on about the features of the ASRock Z77 OC Formula such as the customer OC profile designed by Nick Shih. I didn’t even cover the features you get from ASRock such as all the XFast features, UEFI BIOS, and AXTU (renamed Formula Drive). The ASRock OC Formula should be a top pick of any overclockers in the market for a new motherboard. And Steelers fans will love it too.